B579
B579 (Standard Specification for Electrodeposited Coatings of Tin-Lead Alloy (Solder Plate))· ASTM (United States) · 10 materials
| Designation | Material group | |
|---|---|---|
| B579 Cu/SnPb 15 | Sn-based | chevron_right |
| B579 Cu/SnPb 30 | Sn-based | chevron_right |
| B579 Cu/SnPb 5 | Sn-based | chevron_right |
| B579 Cu/SnPb 5f | Sn-based | chevron_right |
| B579 Cu/SnPb 8 | Sn-based | chevron_right |
| B579 Fe/SnPb 10 | Sn-based | chevron_right |
| B579 Fe/SnPb 20 | Sn-based | chevron_right |
| B579 Fe/SnPb 30 | Sn-based | chevron_right |
| B579 Fe/SnPb 5 | Sn-based | chevron_right |
| B579 Fe/SnPb 5f | Sn-based | chevron_right |